| 초록 |
Recently, stamping transfer process has been considered by a relatively dry process condition due to improved stability. Previous research into applying interlayers has only focused on wet-coated methods, such as spin coating, to form the interlayer. In this research, we investigated stamping transferred interlayer via polyurethane acrylate(PUA), of which the surface energy was modified by 2-hydroxyethyl methacrylate(HEMA) to increase the transfer reproducibility. We fabricated planar-type PSCs with deposited 6,6-phenyl-C71 butyric acid methyl ester(PC71BM) layer on to CH3NH3PbI3(MAPbI3) layer by dry stamping transfer condition. Moreover, we confirmed enhanced JSC and comparable power conversion efficiency(PCE), which were caused by enhanced coverage of ETL onto the MAPbI3, which occurs improved electron mobility and exciton dissociation. Especially, durability of the dry stamping transferred device was observed by morphological analysis and electrical measurement of the device. |
