| 학회 | 한국고분자학회 |
| 학술대회 | 2005년 가을 (10/13 ~ 10/14, 제주 ICC) |
| 권호 | 30권 2호 |
| 발표분야 | 고분자 가공/블렌드 |
| 제목 | Study on thermal properties of thermally conductive filler loaded PEEK |
| 초록 | New applications, like heat sinks in electronics and heat exchanger in the refrigeration require new composites with higher thermal diffusivity. By the addition of conductive fillers to plastics the thermal properties of polymers can be increased significantly. In this paper, The thermal properties of PEEK composites containing boron nitride(BN) and aluminum nitride(AlN) was investigated from room temperature up to 100℃ measured by the laser flash method. Increasing filler content, thermal diffusivity was increased from 0.002044cm2/s without filler up to 0.01122cm2/s with 50 vol% BN at ambient temperature. Thermal diffusivity was decreased slightly with temperature increase. Differential scanning calorimetry (DSC) with sapphire reference was used to measure the specific heat capacity (Cp) up to 100℃. Specific heat capacity (Cp) showed that it tends to be increased with temperature and decreased with filler loaded. Fig 1. Thermal properties of the BN loaded PEEK composites (a) Specific heat, (b) Thermal diffusivity. |
| 저자 | 김대훈1, 김동주1, 권기준1, 박종만2, 김성룡1 |
| 소속 | 1충주대, 2경상대 |
| 키워드 | 열전도성 고분자; PEEK |
