| 학회 | 한국고분자학회 |
| 학술대회 | 2004년 가을 (10/08 ~ 10/09, 경북대학교) |
| 권호 | 29권 2호, p.515 |
| 발표분야 | 고분자 구조 및 물성 |
| 제목 | Behaviors of Oxydianiline-Based different High Temperature Polyimide Thin Films |
| 초록 | Poly(amic acid)[PAA] precursors of three different polyimides in thin films with various backbone structures were synthesized: PMDA-4,4’ODA, BPDA-4,4’ODA and 6FDA-4,4’ODA. For the polyimide films, the residual stress was investigated by using Thin Film Stress Analyzer(TFSA) and the dielectric constants were investigated by using the capacitance and optical methods. At humid environment, the water diffusion behaviors was measured by gravimetric method. In addition, their morphological structures were examined by X-ray diffraction. For each different polyimide, residual stress and dielectric constant are quite different, strongly depending upon the chemical and morphological structures and were in the decreasing order 6FDA-4,4ODA ＞ BPDA-4,4ODA ＞ PMDA-4,4ODA and BPDA-4,4ODA ＞ PMDA-4,4ODA ＞ 6FDA-4,4ODA respectively. The degree of dielectric variation is in the increasing order: BPDA-4,4ODA ＜ 6FDA-4,4ODA ＜ PMDA-4,4ODA. It is closely related to the amount of absorbing water. According to absorbing water, the dielectric behavior in all the polyimide thin films well fitted to the Fickian diffusion model and their kinetics is closely related to the water diffusion kinetics. The dielectric variation coefficients in films vary in the range of 4.8 10-10 cm2/sec to 7.2 10-10 cm2/sec, is in the increasing order: BPDA-4,4ODA ＜ PMDA-4,4ODA ＜ 6FDA-4,4ODA. This work was supported by center for Elctronic Packaging materials of Korea Science and Engineering foundation |
| 저자 | 박선아, 장원봉, 권진욱, 이호성, 김민주, 김재헌, 설용건, 한학수 |
| 소속 | 연세대 |
| 키워드 | epoxy; amine |
