| 초록 |
Recently, the development of pressure-sensitive adhesives with excellent heat resistance is being studied for the application to the process of microelectronics. Also, acryl and silicon-based polymeric materials are widely used as the main material for PSA. In this study, we designed a series of hybrid poly(imide siloxane) composites by using ladder-like poly(methacryloxypropyl) silsesquioxane for enhancing adhesive and thermal properties. LPMS was synthesized by a simple sol-gel method using 3-(methacryloxy)propyl trimethoxysilane. Organic-inorganic ladder-like polysilsesquioxane (LPS) has excellent chemical and thermal property. Also, LPS with general formula (RSiO3/2)n consisting of Si-O-Si backbone and functional group (R), where R group can be acryl, phenyl, epoxy or high molecular weight organic groups. The structure of LPMS were confirmed by 1H-NMR and FT-IR. And, the characteristics of hybrid poly(imide siloxane) composites with LPMS were analyzed by various analytical tools. |
