| 학회 |
한국화학공학회 |
| 학술대회 |
2003년 봄 (04/25 ~ 04/26, 순천대학교) |
| 권호 |
9권 1호, p.991 |
| 발표분야 |
재료 |
| 제목 |
배합고무의 가황속도가 구리박막코드와의 접착에 미치는 영향 |
| 초록 |
Copper-plated steel cord was prepared and its adhesion properties to rubber compounds which have different loading amount of both sulfur and accelerator, were examined in comparison with brass-plated steel cord. The lower adhesion force of copper-plated steel cord to the rubber compound was obtained compared to brass-plated steel cord. The copper-plated steel cord showed higher adhesion retention than brass-plated steel cord against hostile environment. The adhesion stability against humidity aging and thermal aging of copper-plated steel cord was discussed compared to those of the brass-plated steel cord. The pull-out force of copper-plated steel cord to rubber compound was inversely correlated with cure rate of rubber compound. |
| 저자 |
전경수1, 서 곤2
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| 소속 |
1담양대, 2전남대 응용화학부 |
| 키워드 |
접착; 배합고무; 가황속도; 구리박막코드; 황동피복코드; 접착내구력
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| E-Mail |
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| 원문파일 |
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