| 초록 |
Heat-dissipating composites has been considered as the most promising solution to resolve the problems caused by heat-accumulation-induced malfunction of electronic devices. Liquid crystalline epoxy resin (LCER) forming an ordered molecular structure even after curing has been spotlighted to resolve the low thermal conductivity of polymeric matrix (~ 0.2 W/mK in general). Recently, we reported a novel curing method considerably enhancing the thermal conductivity of the LCER via linear weaving of the aligned liquid crystal molecules. Here, the correlation between molecular weight of LCER and its thermal conductivity was investigated to enhance the thermal conductivity further. The crystallinity of LCER after curing was found to be a strong function of the molecular weight due to variation in liquid crystal formation temperature window. Finally, thermal conductivities of cured-LCER and its composites were optimized by careful tuning of molecular weight of LCER. |
