| 초록 |
Heat of electronic devices must be dissipated for stability. Epoxy composite, as various shapes and electrical insulation, would be used for thermal dissipating materials. For example, heat sinks provide a path for heat from the LED source to outside medium. Epoxy composites need to be filled with electrically insulative and thermally conductive nanomatrials due to low thermal conductivity of epoxy resin. Boron nitride nanosheet (BNNS) that was obtained from exfoliation hexagonal boron nitride (h-BN) will be a good candidate for the fillers. In this study, Thermal conductivity of BNNS-epoxy composite will be presented in term of filler contents and surface treatments. Thermal conductivity was measured with the laser flash method. |
