| 학회 |
한국공업화학회 |
| 학술대회 |
2019년 봄 (05/01 ~ 05/03, 부산 벡스코(BEXCO)) |
| 권호 |
23권 1호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Study on Heat-peelable Behavior of Acrylic Pressure Sensitive Adhesives with Hydrogen Bond |
| 초록 |
The heat-peelable pressure-sensitive adhesive is easy to peel off due to decrease of adhesion when heat is applied, and is applied to a dry printing process of fibers and leather, etc. In order to reduce adhesion, it is widely applied that method of introducing a functional group of decomposing at a high temperature into the backbone of the acrylic PSA, or introduce thermal expansion particles to destroy the adhesive portion between the PSA and the substrate. However, these methods are irreversible, and takes a long time to reduce the adhesion. To overcome these drawbacks, we introduced hydrogen bonding in the acrylic PSAs. Hydrogen bonding which is an intermolecular secondary bond can be peeled off at high temperature in a short time, and can be reversibly used. Heat-peelable acrylic PSAs were synthesized via photo-polymerization and the influence of hydrogen bond of synthesized acrylic PSAs were characterized by FT-IR, DSC, TGA and Peel tester (rt~150˚C). |
| 저자 |
석웅철, 박성원, 송민성, 임종태, 권세진, 강주희, 송호준, 이상국
|
| 소속 |
한국생산기술(연) |
| 키워드 |
Heat-peelable; Acrylic PSAs; Hydrogen bonding
|
| E-Mail |
|
