| 초록 |
We fabricated size-controllable 3D patterned nanostructures with a wide range of resolutions and a high aspect ratio over a large area through controlled plasma ion reactions (secondary sputtering phenomenon) and an electroplating process. This technique can produce various 3D patterns with ultrahigh resolution by utilizing (i) secondary sputtering during the plasma ion process, which can enable the fabrication of 3D structures on the 10 nm scale, and (ii) finely controlled electroplating, which can control the resolution of nanostructures through simple solution reactions by increasing the thickness of the original 10 nm-scale SSL-derived structures. Additionally, this technique can be extended to produce features with various 3D shapes (lines, hole-cylinders) from various other conductive materials (Cu, Al, Ag, etc.) on various types of substrates (silicon wafers, transparent glass, and flexible PC films). |
