| 초록 |
In semi conductor package, crack or warpage will be happened because of difference of thermal stress between chip and epoxy molding compound (EMC). So, the EMC in semi conductor was required high thermal conductivity and low coefficient of thermal expansion (CTE), and high flexibility was also needed to prevent crack or warpage of EMC. For high thermal conductivity, high crystalline hardener such as naphthalene was used with commercial bisphenol A type epoxy resin. Also, the high content of fillers such as large and small size sillica were added for low CTE. Additionally, styrene-co-glycidylmethacrylate random copolymer (RCP) was synthesized and added in EMC to enhance the flexibility of EMC. The analysis of CTE of silica filled EMC was conducted using Schapery’s theory to set up the content of fillers. To investigate of curing reaction of EMC and mixing conditions of melt mixing (two-roll mixing), differential scanning calorimeter (DSC) analysis was performed and the tensile and flexural properties were also measured to investigate the mechanical properties of RCP filled EMC using universal test machine (UTM). The dispersion state of silica in EMC and interfacial state between epoxy resin and silica were examined by morphological analyze with field emission scanning electron microscope (FE-SEM) measurement. |
