| 학회 | 한국화학공학회 |
| 학술대회 | 2014년 가을 (10/22 ~ 10/24, 대전 DCC) |
| 권호 | 20권 2호, p.1191 |
| 발표분야 | 고분자 |
| 제목 | The effect of end capped crosslinking on polyimide for low thermal expansion(CTE) |
| 초록 | Polyimide is an outstanding aromatic polymer for aerospace and microelectronic devices.In this study, a crosslinking agent was introduced to synthesize the polyimide film. The crosslinking agent was used to improve the thermal property of the polymer. A series of polyimide thin film had been prepared from polyamic acid with 4,4’-Diaminodiohenylether(ODA), 3,3’4,4’-Benzophenonetetracarboxylic Dianhydride (BTDA) and a crosslinking agent. The end capped crosslinked polyimide was characterized by confirming the synthesis with the FT-IR. The DSC, TMA, DMA was used to analyze the thermal property of the crosslinked polyimide. Through this study we were able to confirm the effect of crosslinking agents on CTE (Coefficient of Thermal Expansion) and the modulus of the polyimide. |
| 저자 | 유태원, 한학수 |
| 소속 | 연세대 |
| 키워드 | Polyimide; Thermal property; CTE(Thermal expansion); Microelectronic; Modulus |
| 원문파일 | 초록 보기 |
