| 학회 | 한국공업화학회 |
| 학술대회 | 2022년 봄 (05/11 ~ 05/13, 제주국제컨벤션센터(ICC JEJU)) |
| 권호 | 26권 1호 |
| 발표분야 | 포스터-디스플레이 |
| 제목 | Layer-by-Layer Etching of Copper Thin Films Using Acetylacetone/O2/Ar Gas Mixture |
| 초록 | Cu films are etched using acetylacetone(acac)/O2/Ar gas mixture via layer-by-layer etching method. The hexafluoroacetylacetone(hfac)/O2 gas mixture was employed for Cu dry etching at over 300℃. They claimed good etch profile of thin Cu films was obtained using atomic layer etching. However, the etch slope of 45˚ was obtained, which is isotropic etching. We will investigate the etch properties of Cu thin films via layer-by-layer with 2 step processes. As a step 1, the surface modification of Cu films is conducted using acac/O2 gas at room temperature and in the step 2, Ar sputtering on the modified Cu surfaces is carried out. Acknowledgment: This work was supported by Korea Institute for Advancement of Technology(KIAT) grant funded by the Korea Government(MOTIE) (P0008458, HRD Program for Industrial Innovation) |
| 저자 | 김승현, 임은택, 박성용, 정지원 |
| 소속 | 인하대 |
| 키워드 | layer-by-layer etching; plasma etching; dry etching |
