| 학회 | 한국화학공학회 |
| 학술대회 | 1998년 봄 (04/24 ~ 04/25, KOEX) |
| 권호 | 4권 1호, p.1105 |
| 발표분야 | 재료 |
| 제목 | 디아민의 구조가 내열성 폴리이미드 박막의 잔류응력 및 기계적 물성에 미치는 영향 |
| 초록 | Using wafer bending technique, residual stress behavior of high temperature poly(biphenyltetracarboximide) thin films with three different diamine structures,p-phenylene diamine (PDA), benzidine (BZ), and oxydianiline (ODA), was in-situinvestigated during imidization from poly(amic acid) solutions. The residual stressbehavior was strongly dependent upon the diamine structure, especially its linearity,resulting in low stress values at RT for BPDA-PDA and BPDA-BZ with biphenylmoiety. From the comparison of the residual stress behavior with mechanical properties,biphenyl moiety in polyimide backbone structure is shown to play a important role forshort-range molecular motion while its linearity gives the polyimide films stiffness andgood mechanical property. In addition, moisture-induced stress relaxation with time inthe cured polyimide films was investigated and stress relaxation coefficients by watersorption were obtained by fitting with Fickian equation. |
| 저자 | 박성국, 정현수, 조영일, 한학수 |
| 소속 | 연세대 |
| 키워드 | polyimides; residual stress; residual stress relaxation |
| 원문파일 | 초록 보기 |
