| 초록 |
We describe polyimide films for flexible display substrate which should have high heating resistance and low coefficient of thermal expansion(CTE) values. In the present work, we demonstrates the application polyimide/silica composite film. In here, polyimide/silica (PI/SiO2) composite films were prepared from polyamic acid(PAA), which was prepared by the reaction of 2,2'-Bis-(3,4-Dicarboxyphenyl) hexafluoropropane dianhydride (6FDA), 4,4′-Diaminobiphenyl(Bz) and 3,5-Diaminobenzoic acid (HAB) in N,N-dimethylacetamide (DMAc), with different content of (3-Aminopropyl)trimethoxysilane (APTMS) and Tetraethyl orthosilicate (TEOS). The molecular structures of the composite materials were analyzed by means of fourier transform infrared spectrometer (FT-IR) and proton nuclear magnetic resonance (1H NMR). Thermogravimetric analysis (TGA), differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA) results will be discussed. |
