| 초록 |
Recently, the polymer/silver nanocomposites have been extensively studied for isotropical conductive adhesives (ICAs) application. In this work, we have illustrated a novel method, both experimentally and theoretically, for improving the electrical conductivity and thermomechanical properties of epoxy/silver nanocomposites by adding silica particles. Upon addition of silica particles, both the electrical percolation threshold concentration of the silver nanoparticles and the electrical resistivity of the composite decreased significantly. Adding silica particles also enhanced the thermomechanical properties, such as coefficient of thermal expansion (CTE). We used molecular simulations to show that the effective intermolecular interactions between silver nanoparticles should become more attractive as ΦSi is increased, which should assist formation of the electrical percolation network. |
