| 초록 |
Gold electrodes were prepared on polyimide films via microcontact printing (MCP) of 3-aminopropyltriethoxysilane (-APS), followed by the layer-by-layer (LBL) deposition of gold nanoparticles (GNPs) and sintering. First, the polyimide layer on silicon wafer was modified via water plasma etching, followed by the MCP of -APS using a polydimethylsiloxane (PDMS) stamp. Next, the multilayer of GNPs was formed on the -APS layer by the LBL deposition of citrate-capped GNPs and poly(ethyleneimine) (PEI) or ethylenedimine (EDA). Then, the samples were subjected to sintering to produce metallic gold. Finally, gold patterns were prepared with a patterned PDMS stamp (line width of 10 um). The GNP multilayer was characterized by UV-vis/near-IR spectrometer, atomic force microscopy (AFM), optical microscopy (OM), alpha-step and electrical conductivity measurement by 2-point probe method. |
