| 학회 | 한국고분자학회 |
| 학술대회 | 2005년 봄 (04/14 ~ 04/15, 전경련회관) |
| 권호 | 30권 1호, p.319 |
| 발표분야 | 유기반도체 |
| 제목 | Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers |
| 초록 | With the aim of improving the electrical and adhesion properties of a novel metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver; the S-Ag bond was found to be stable upon heat treatment (150°C, 1 hr). In contrast, silver atoms deposited onto a CH3-modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31×10-2 Ωcm2) was found to be much lower than that of the silver thin film deposited on the CH3-modified surface (495.58 Ωcm2), which is due to the reaction-induced gap states formed at the interface between the Ag electrode and the SH-terminated surface (Figure 1). Figure1. Plots of the measured total resistance (Rt) versus the spacings (d) between the TLM pads. |
| 저자 | 조정호, 임정아, 한중탁, 장호원, 이종람, 조길원 |
| 소속 | 포항공과대 |
| 키워드 | Contact resistance; Self-assembled monolayer |
