| 학회 |
한국고분자학회 |
| 학술대회 |
2009년 가을 (10/08 ~ 10/09, 광주과학기술원 오룡관) |
| 권호 |
34권 2호 |
| 발표분야 |
기능성 고분자 |
| 제목 |
Preparation and dielectrical properties of carbon/polyimide composite film |
| 초록 |
Polyimides (PIs) are well known for their high-temperature durability, good mechanical properties, excellent chemical and thermal stabilities, low thermal expansion coefficient, and low-dielectric constant. However, with dielectric constants of about 3.1~3.5, the conventional PIs are insufficient for meeting the requirement of microelectronic and insulating applications. The novel low-dielectric constant (low-k) PI composite films containing activated carbon powders were successfully prepared via spin coating and thermal imidization. The dielectrical and thermal properties were analyzed by C-V technique and thermal gravity analysis (TGA). The resultant composite films had lower dielectric constants and higher thermal stability than pure PI film. The reduction of the dielectric constant is attributed to both the incorporation of the voids stored within the porous activated carbon and the air existing in the gaps on the interfaces between the carbon and the PI matrix. |
| 저자 |
김상진1, 윤석민1, 강필현2, 노영창2, 이영석1
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| 소속 |
1충남대, 2한국원자력(연) |
| 키워드 |
polyimide; activated carbon; composite film; low dielectric constant
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| E-Mail |
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