| 학회 | 한국재료학회 |
| 학술대회 | 2012년 가을 (11/07 ~ 11/09, 라카이샌드파인 리조트) |
| 권호 | 18권 2호 |
| 발표분야 | A. 전자/반도체 재료(Electronic and Semiconductor Materials) |
| 제목 | 수평 스프레이 방식 wet공정의 공정특성 균일화를 위한 평가도구 개발 |
| 초록 | In practical wet process of PCB manufacturing such as etching, rinsing and developing process, reactive or non-reactive liquid would be sprayed on the PCB panel through nozzles collectively connected to the manifold. As one PCB panel in manufacturing process has the pre-determined number of PCB products(units), the uniformity of these wet processes which is defined as the performance difference within a panel is one of the most important features of wet process. In this paper, the prediction of nozzle trajectory has been performed by the combination of algebraic formula and numerical simulation. With the pre-determined geometrical factors of nozzle distribution, the trajectories of individual nozzles were predicted with the change of process operational conditions such as panel speed, nozzle swing frequency and so on. With the help of this newly developed tool, it is possible to predict the uniformity of etching, developing and rinsing performance. It is expected to be very useful way to improve the wet process at manufacturing any PCB products. |
| 저자 | 정기호 |
| 소속 | 삼성전기 ACI사업부 FCB제조기술G |
| 키워드 | spray array; wet-process; PCB; uniformity |
