| 초록 |
A thin film encapsulation (TFE) was fabricated by alternatively depositing organic and inorganic layers via initiated chemical vapor deposition (iCVD) and atomic layer deposition (ALD). Poly(1,3,5-trimethyl-1,3,5-trivinylcyclotrisiloxane) (pV3D3), a highly crosslinked organosilicone polymer, was introduced as a new material for the organic layer within TFE. The interface with ALD Al2O3 layer was smooth and stable. The pV3D3/Al2O3 multilayer TFE exhibited high light transparency and outstanding barrier property. Finally, the multilayer TFE was monolithically deposited on organic solar cells (OSCs) and the shelf life of the devices was immensely increased while its initial power conversion efficiency (PCE) was uneffected. It suggests that the newly developed organic/inorganic multilayer TFE is an effective barrier to elongate the lifetime of organic electronics. |
