| 초록 |
The Cu electrodeposition was conducted in choline chloride/ethylene glycol deep eutectic solvent (DES) at room temperature. The electrodeposition of copper carried out by constant current and pulse current methods at 3.5mA/cm2 with a rotation speed of 200rpm using a Rotating Disk Electrode (RDE). Applied pulse current had various frequencies (0.005Hz, 0.5Hz, 50Hz) and duty cycles (20%, 50%, 80%). The deposition kinetics of Cu was investigated by Cyclic voltammetry (CV) using a RDE before the Cu plating. The morphology of the deposits was observed by Scanning Electron Microscopy (SEM) and compositional analysis was investigated by Energy-Dispersive X-ray Spectroscopy (EDXS). It is shown that the smoother surface of Cu deposits with finer grains was obtained under pulse current, compared to that under constant current. The Cu layer tends to become more homogeneous with the increase of the pulse frequency. At 50% duty cycle, the most homogeneous Cu deposits were formed. |
