| 초록 |
Fluorocarbons used in the plasma etching and chemical vapor deposition process of semiconductor industry. Moreover, fluorocarbons are powerful of greenhouse gases. Therefore, fluorocarbons such as C2F6 in the gas waste of the process must be removed before gas waste into the air. In this study, reaction of CO2 and C2F6 will be performed in a coaxial dielectric barrier discharge plasma reactor for C2F6 conversion. Several factors of process will be considered such as applied voltage, resident time and ratio of C2F6/CO2 in the feed gas. These parameters will consider aspects to reactants conversion. |
