| 초록 |
The acryl/epoxy dual curing system is a good way to improve the adhesive strength. In the acryl / epoxy dual curing system, the acrylate polymer chain is formed through the primary UV curing, and the additional curing reaction between the functional group of the acrylate and the epoxy occurs through the secondary thermal curing. The adhesion properties of the dual curable adhesive can be adjusted by the type of acrylic monomer. Butyl acrylate and 2-ethyl hexyl acrylate are used for the enhancement of adhesion. Isobornyl methacrylate and cyclo hexyl acrylate are used to improve heat resistance. Acrylic acid, 2-hydroxy ethyl acrylate, and hydroxyl propyl acrylate are used for the thermal curing with epoxy. The UV and thermal curing behaviors of the dual curable adhesives were investigated using photo-differential scanning calorimetry, fourier transform infrared spectrophotometer, and the determination of the gel fraction, pendulum hardness and adhesion strength. |
