| 학회 | 한국고분자학회 |
| 학술대회 | 2004년 가을 (10/08 ~ 10/09, 경북대학교) |
| 권호 | 29권 2호, p.496 |
| 발표분야 | 고분자 구조 및 물성 |
| 제목 | Characterization and Thermo-Mechanical Properties of Polyimide Films Prepared from 4-Components Monomer |
| 초록 | Polyimide film has been used as FPCB (flexible printed circuit board), TAB (tape automated bonding), electric wire insulated clothing materials and tape, because it had high heat- and cold-resistance and high performance electric properties1,2. The CTE (coefficient of thermal expansion) relationship of polyimide film and copper foil is one of most important factor in preparation for FCCL (flexible copper clad laminate) constituting FPCB. If discrepancy in CTE value of film and copper foil was high, it showed that CCL was curled. Hence, in this study, we polymerized polyamic acid from 4-component monomer, in order to CTE value decrease in PMDA-ODA system, and prepared polyimide films. Anhydride and diamine mole ratio controlled by BTDA/ PMDA and PDA/ODA, respectively. The CTE value of resulting materials showed that more depend on PDA/ODA mole ratio than that of BTDA/PMDA (Figure 1). As PDA content increased, elastic modulus and tensile strength increased, too (Figure 2). Figure 1. CTE value according to content of PDA (a) and BTDA (b). Figure 2. Elastic modulus (a) and tensile strength(b) according to PDA. Reference 1. Fuji Chimera Research Inc.,編輯部,“機能性 高分子 フィルムの 現狀と 將來展望”, Fuji Chimera Research Inc., Tokyo, 2002. 2. 今井 淑夫, 橫田 力男, “最新 ポリイミド- 基礎と 應用”, S.T.S, Tokyo, 2002. |
| 저자 | 설경일1, 김용원2, 원종찬1, 최길영1 |
| 소속 | 1한국화학(연), 2㈜ SKC 필름(연) |
| 키워드 | polyimide; CTE |
