화학공학소재연구정보센터
학회 한국공업화학회
학술대회 2018년 가을 (10/31 ~ 11/02, 제주국제컨벤션센터(ICC JEJU))
권호 22권 2호
발표분야 디스플레이_포스터
제목 The Influence of Hydrogen Bond of Heat-peelable Behavior and Characterization of Acrylic Pressure-sensitive Adhesives
초록 The heat-peelable pressure-sensitive adhesive is easy to peel off due to decrease of adhesion when heat is applied, and is applied to a dry printing process of fibers and leather, etc. In order to reduce adhesion, a method of introduce a functional group of decomposing at a high temperature into the backbone of the acrylic PSA, or introduce thermal expansion particles to destroy the adhesive portion between the PSA and the adherend is widely applied. However, this method is irreversible, and takes a long time to reduce the adhesion. In this study, we introduced a functional group capable of hydrogen bonding in the acrylic PSA. In this study, we synthesized acrylic PSAs which are reversible by introducing hydrogen bond which is an intermolecular secondary bond and can be peel off at high temperature in a short time. The influence of hydrogen bond of synthesized acrylic PSAs were characterized by FT-IR, DSC, TGA and Peel tester (rt, 150˚C)
저자 석웅철, 박성원, 임종태, 권세진, 강주희, 송호준, 이상국
소속 한국생산기술(연)
키워드 Acrylic PSA; UV-polymerization; Heat-peelable; Hydrogen bond
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