| 학회 |
한국공업화학회 |
| 학술대회 |
2019년 가을 (10/30 ~ 11/01, 제주국제컨벤션센터(ICC JEJU)) |
| 권호 |
23권 2호 |
| 발표분야 |
포스터_디스플레이 |
| 제목 |
Investigation of Biphenyl-curing agents in Epoxy Resin for Superior Insulating Thermally Conductive Composites |
| 초록 |
Recently developments in thermal dissipation have heightened the need for advanced polymeric thermal conductive composite with inexpensive, easy handling, prominent workability and outstanding mechanical properties. However, a major problem with polymers is a low thermal conductivity in the range of 0.10-0.25 W/m∙K. For the biphenyl system, there are stronger interaction between the molecules due to the double bonds in the phenyl rings. Based on the assumption of mesogenic groups being able to align liquid-crystal (LC) molecules, we have designed a novel epoxy resin bearing biphenyl mesogenic groups and investigate the thermal properties of new diamines with biphenyl groups as hardener for improved thermally conductive composites. |
| 저자 |
강주희, 박성원, 임종태, 석웅철, 송호준, 이상국
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| 소속 |
한국생산기술(연) |
| 키워드 |
Epoxy resin; Diamine; Thermal conductivity
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| E-Mail |
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