| 학회 | 한국공업화학회 |
| 학술대회 | 2018년 가을 (10/31 ~ 11/02, 제주국제컨벤션센터(ICC JEJU)) |
| 권호 | 22권 2호 |
| 발표분야 | (산학연협력위원회/생기원) 차세대 기능성 소재 개발 |
| 제목 | Development of Metal paste for electronic device |
| 초록 | In the lecture, the characteristic properties of silver pastes is considered with various binders. For the industrial applications, the reliability of material should be satisfied. In order to that, various binders are used such as polyurethane, polyester, silicone, epoxy and etc. Exax ltd. Company has experiences in this field for more than 10 years including Ag dot paste, TSP electrode materials and RFID antenna application. From this lecture, we hope to make audience understand the need of market and the characteristic of silver pates. |
| 저자 | 조준혁 |
| 소속 | (주) 이그잭스 |
| 키워드 | |
