| 학회 |
한국고분자학회 |
| 학술대회 |
2010년 가을 (10/07 ~ 10/08, 대구 EXCO) |
| 권호 |
35권 2호 |
| 발표분야 |
고분자 가공/복합재료 |
| 제목 |
Thermal conductivity of biphenyl epoxy resin by changing the contents of additives |
| 초록 |
Epoxy resin was investigated for improvement of thermal conductivity by π-π stacking. To increase among benzene ring, biphenyl epoxy was prepared by changing respective contents of surfactant (0 ~ 10 phr) and filler (0 ~ 30 vol.%). Epoxy resin was cured at the range of 100 ~ 180 oC and curing temperature was confirmed by differential scanning calorimetry (DSC). Thermal conductivity was measured by the hot-wire method and increased at surfactant 10 phr and filler 30 vol.%. It was presented that epoxy composite mixed with surfactant and filler above 0.5 W/mK. Morphology of epoxy resin was observed with the field emission scanning electron microscope (FE-SEM) and the high resolution transmission electron microscope (HR-TEM). |
| 저자 |
강민하1, 서경혁1, 한상학1, 김진철2, 윤호규1
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| 소속 |
1고려대, 2삼성전기 |
| 키워드 |
Epoxy resin; thermal conductivity; degree of crystalization
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| E-Mail |
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