| 학회 |
한국고분자학회 |
| 학술대회 |
2008년 가을 (10/09 ~ 10/10, 일산킨텍스) |
| 권호 |
33권 2호 |
| 발표분야 |
고분자 가공/복합재료 |
| 제목 |
Thermally stable EMI shielding film with polyimide/SENDUST/PEDOT |
| 초록 |
Since the thermal stability is one of the most important points to be considered in certain the EMI shielding films, we used polyimide as the matrix for EMI shielding film. We synthesized polyimide precursor based on 4,4-oxydiphthalic anhydride(ODPA) or pyromellitic dianhydride(PMDA) and 4,4-oxydianiline(ODA). Dissolved in DMAc. After the solution was cast into the glass plated coated with PEDOT using bar coater, the film was fabricated by thermal imidization at 80℃ for 1hr, 150℃ for 1hr, 250℃ for 1hr. The obtained dark goldish film was investigated by GPC and IR to confirm the polymerizatior and by TGA for thermal stability. |
| 저자 |
전병국1, 한지은1, 하태민1, 조승현1, 이경섭2, 이준영1
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| 소속 |
1성균관대, 2(주)창성 |
| 키워드 |
polyimide; EMI shielding film;
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| E-Mail |
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