| 학회 |
한국공업화학회 |
| 학술대회 |
2015년 봄 (04/29 ~ 05/01, BEXCO (부산)) |
| 권호 |
19권 1호 |
| 발표분야 |
고분자_포스터 |
| 제목 |
Poly(amide-imide) with Low Residual Stress for Electronic Material |
| 초록 |
Poly(amide-imide) was synthesized at low temperature process to offer a thermal stable memebrane with low residual stress. The low crack polymer with low glass transition temperature could be used to various applications such as semiconductors, integrated circuits, coating materials and display. Thermal stabilities of the polymer was confirmed by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The residual stress of the polymer was confirmed by Thin fimls stress analyzer(TFSA). |
| 저자 |
김광인, 진호정, 한학수
|
| 소속 |
연세대 |
| 키워드 |
poly(amide-imide); residual stress; thermal stability; glass transition temperature
|
| E-Mail |
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