| 학회 |
한국공업화학회 |
| 학술대회 |
2018년 봄 (05/02 ~ 05/04, 대구 엑스코(EXCO)) |
| 권호 |
22권 1호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Functionalized boron nitride for epoxy composites with improved thermal conductivity |
| 초록 |
To obtain favorable thermal conductivity, high loading levels of fillers are usually required over 50 vol%, which in return deteriorate mechanical and processing properties. Herein, we have designed a structure of 2D functionalized hexagonal boron nitride (h-BN) fillers for various epoxy composites with high thermal conductivity. So as to increase interface interaction, the fillers are functionalized with amino group. Surface modification can enhance many physical properties of composites, such as thermal conductivity and thermal stability. Essentially, the functionalized h-BN presents noticeable effects on thermal conductivity. |
| 저자 |
강주희, 강호용, 임종태, 석웅철, 권세진, 송호준, 이상국
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| 소속 |
한국생산기술(연) |
| 키워드 |
thermal conductivity; boron nitride; epoxy composites
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| E-Mail |
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