| 학회 |
한국고분자학회 |
| 학술대회 |
2014년 가을 (10/06 ~ 10/08, 제주 ICC) |
| 권호 |
39권 2호 |
| 발표분야 |
고분자구조 및 물성 |
| 제목 |
Rheological and electrical properties of epoxy resins filled with graphene nanoplate covered with silver nanoparticles |
| 초록 |
Graphene nanoplate (GNP) is attractive filler for polymers because of its high thermal conductivity and electrical property. However, GNP has some problems such as the high viscosity at low concentration due to the nature resulting from nano size thickness. Silver nanoparticle (AgNP) is attractive filler for polymers because of its high thermal conductivity and electrical conductivity. However, agglomeration of AgNP takes place and efforts to improve the dispersion are necessary. Hybrids of GNP and AgNP in an epoxy resin were investigated in this study. It was found that GNPs could prevent agglomeration of AgNPs. In addition, the hybrid systems showed lower viscosity at the same filler contents in comparison with GNP system. Dispersion and interfacial properties of simple mixture of GNP and AgNP (AGM) and hybrid of AgNP and GNP (AGH) were characterized employing rheometry and electrical property. It was observed that the performance of AGH systems is superior to that of AGM systems. |
| 저자 |
송광석, 이대수
|
| 소속 |
전북대 |
| 키워드 |
graphene nanoplate; hybrid; silver nanoparticle; rheology
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| E-Mail |
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