| 학회 | 한국재료학회 |
| 학술대회 | 2007년 봄 (05/10 ~ 05/11, 무주리조트) |
| 권호 | 13권 1호 |
| 발표분야 | 전자재료 |
| 제목 | Toughening of epoxy blends with high performance thermoplastics |
| 초록 | Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. In this work, we synthesized dielectric composite materials based on epoxy resin, and investigated their thermal stabilities and dynamic mechanical properties for thermal imprint lithography. In order to enhance the mechanical properties and toughness of dielectric material, various modified polyetherimide(PEI) was applied in the resin system. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various conditions were studied using dynamic differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and Universal Test Method (INSTRON). |
| 저자 | 이정우, 나승현 |
| 소속 | 삼성전기 |
| 키워드 | Epoxy resin; thermoplastic polymer; Polyetherimide; toughness; Imprint |
