| 초록 |
We describe polyimide films for flexible display substrate which should have high heating resistance and low CTE (coefficient of thermal expansion) values. A series of polyimide containing were synthesized by conventional solution polymerization. Thermally cross-linked moieties were prepared by the reaction of p-phenylenediacrylic acid (PDA) and p-phenylenediamine (PDA), 2,2'-Bis-(3,4-Dicarboxyphenyl) hexafluoropropane dianhydride (6FDA), 2,2'-Bis(trifluoromethyl)benzidine (22TFMB) in N,N-dimethylacetamide (DMAc). The molecular structures of the composite materials were investigated and 1H-NMR by means of Fourier transform infrared spectrometer (FT-IR). Thermogravimetric analysis (TGA), Differential scanning calorimetry (DSC) and Dynamic mechanical thermal analysis (DMTA) showed that the excellent thermal stability of polyimides. |
