| 초록 |
CuCl2 used in chemical etching of copper typically include a complexing agent. Our present work investigates the effectiveness of poly electrolyte as a complexing agent for Cu with H2O2 and HCl employed as an oxidizer. We show that the rate of copper removal from Cu increases when both poly electrolyte and H2O2 are used in acidic solutions (＜ pH 2.0). We investigate the underlying surface reactions of these effects by using CMI in combination with Mali-TOF analysis. We analyze the relative roles of poly electrolyte, H2O2, and solution pH in Cu removal, and take the life cycle of poly electrolyte in this system. |
