| 학회 | 한국재료학회 |
| 학술대회 | 2013년 봄 (05/23 ~ 05/24, 여수 엠블호텔(THE MVL)) |
| 권호 | 19권 1호 |
| 발표분야 | E. 구조 재료(Structural Materials) |
| 제목 | Analysis of tungsten film electrodeposited from a ZnCl2-NaCl-KCl-WO3 melt at low temperature |
| 초록 | Microparts for micro-electro-mechanical systems (MEMS) are becoming increasingly important, and the Lithographie Galvonoformung Abformung (LIGA) process for producing such parts is attracting attention. However, as this process requires the step of electroplating in aqueous solution, only copper, nickel and their alloys can be sued because of the limit of the potential window of water. We have been attempting to apply the electroplating of refractory metals in molten salts to the LIGA process or to the surface coating of conventional LIGA micorpoarts in order to give higher strength and heat resistance for the microparts. The electrodeposition of tungsten in ZnCl2-NaCl-KCl-WO2 melt at low temperature was further studied to obtain a thicker deposit. In the ordinary electrolysis at 0.05 V vs. Zn(II)/Zn, the current density decreased from 1.2 mA cm-2 to 0.3 mA cm-2 in 6h. It was found that the soluble tungsten species slowly changes to insoluble ones in the melt. The soluble species was suggested to be WO3F- anoin. One of the insoluble species was confirmed to be ZnWO4 and the other one was suggested to be K2WO2F4. Electrodeposition was carried out under the same condition as above except for the intermittent addition of WO3 every 2h. The Voltage was kept at the initial value and the thickness was 20 μm. The intermittent addition of WO3 was confirmed to be effective to obtain a thicker tungsten film. The deposited W films are characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). |
| 저자 | 문산, 김주형, 김도경 |
| 소속 | 한국과학기술원 |
| 키워드 | ZnCl2-NaCl-KCl; Electrodeposition; Tungsten |
