| 학회 |
한국고분자학회 |
| 학술대회 |
2010년 가을 (10/07 ~ 10/08, 대구 EXCO) |
| 권호 |
35권 2호 |
| 발표분야 |
기능성 고분자 |
| 제목 |
Adhesion Performance and Morphology with SEM Images in Si-wafer Manufacture Process |
| 초록 |
The aim of this study is to check the performance of acrylic PSAs in si-wafer manufacture process and estimate the degree of residue after peeling with a SEM or a microscopy. Using a UV-curing system, UV-curable PSAs were prepared by blending polymerized PSAs, a photoinitiator and hexa-functional acrylic monomer. The UV-curable PSAs were coated onto polyester (PET) films and cured using conveyor belt type UV-curing equipment with a 100 W high pressure mercury lamp (main wavelength: 365 nm). The peel strength was measured using a Texture Analyzer. The peel strength was determined at a 180o angle with a crosshead speed of 300 mm/min at 20oC based on ASTM D3330. The peel strength is the average force on the debonding process. The force was recorded in g units for 5 different runs and the average force was reported in g/25 mm. |
| 저자 |
이승우, 박지원, 김현중
|
| 소속 |
서울대 |
| 키워드 |
Adhesion; Performance; Morphology; SEM
|
| E-Mail |
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