| 학회 |
한국고분자학회 |
| 학술대회 |
2005년 봄 (04/14 ~ 04/15, 전경련회관) |
| 권호 |
30권 1호, p.550 |
| 발표분야 |
고분자 구조 및 물성 |
| 제목 |
Non-destructive characterization of photo-curable adhesives using Electronic Speckle Pattern Interferometry (ESPI) |
| 초록 |
Photo-cured hybrid adhesives require thermal stability and shrinkage resistance to meet applications in advanced technologies like photonics and electro-optic devices to operate in ambient and aggressive environments. The objective of present research was to obtain an improved understanding of the effects that added silica particles contribute towards thermal deformations and shrinkage on cure. The novel aspect of the research was to follow thermal deformations using Electronic Speckle Pattern Interferometry(ESPI) technique, which allows to make such measurements more accurate and is non-destructive. Bisphenol A epoxy diacrylate, tripropyleneglycol diacrylate(TPGDA) and 1,6-Hexanediol diacrylate(HDDA) resins, containing varying levels of nano silica particles were photo-cured and thermal deformations were investigated and co-related. Our results revealed that nano silica particles apparently reduce thermal deformations, subsequently lowering thermal expansion coefficients of the cured adhesives. Moreover, low cure shrinkage resulted in improved bond strength and is presented in support of ESPI results. It could be concluded that ESPI may be a viable method to evaluate thermal deformations occurring in photo-cured adhesives. |
| 저자 |
주형태, K. B. SHAMSHAD, 홍진후, 강기수, 김경석
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| 소속 |
조선대 |
| 키워드 |
Electronic Speckle Pattern Interferometry(ESPI); Photo-curable adhesive; Thermal deformation; Shrinkage
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| E-Mail |
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