| 학회 |
한국공업화학회 |
| 학술대회 |
2018년 가을 (10/31 ~ 11/02, 제주국제컨벤션센터(ICC JEJU)) |
| 권호 |
22권 2호 |
| 발표분야 |
고분자_포스터 |
| 제목 |
The research tendency of thermal conductivity according to application of polymeric composites with encapsulated PCM |
| 초록 |
We studied to analyze the thermal conductivity tendency of introduced phase change material(PCM) capsules into the polymer matrix. The PCM was encapsulated by interfacial polymerization. Their thermal stability was evaluated by thermogravimetric analysis(TGA) for application to extrusion process with general resins. The polymeric composites were produced with the encapuslated PCM and Polypropylene(PP) by extrusion. The content of dodecane contained in PCM capsules was confirmed by TGA analysis. The latent heat of PCM capsules and the polymeric composites were also measured by differential scanning calorimetry(DSC) analysis. Also thermal conductivity tendency of the polymeric composites observed through thermal conductivity analyzer. As a result, we could compare and analyze the thermal conductivity behavior of encapsulated PCM powder and polymer matrix with PCM capsules. |
| 저자 |
권혁준, 김용수, 황기섭, 이준영
|
| 소속 |
한국생산기술(연) |
| 키워드 |
Phase change materials; Encapsulation; Extrusion; Polymeric composites
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| E-Mail |
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