정찬화 공저 논문
No. | Article |
---|---|
1 |
Microchip sensor of PdO-NiO electrode for H2O2 sensing fabricated with the UV photolithography Kim YS, Yoo TK, Chung CH Korean Journal of Chemical Engineering, 37(10), 1810, 2020 |
2 |
Effect of electrolyte composition on the morphological structures of dendritic copper powders prepared by a spontaneous galvanic displacement reaction Zhuo K, An CY, Kannan PK, Seo N, Park YS, Chung CH Korean Journal of Chemical Engineering, 34(5), 1483, 2017 |
3 |
Formation of nanoporous nickel oxides for supercapacitors prepared by electrodeposition with hydrogen evolution reaction and electrochemical dealloying Jeong MG, Zhuo K, Cherevko S, Chung CH Korean Journal of Chemical Engineering, 29(12), 1802, 2012 |
4 |
Study on electrochemical mechanical polishing process of copper circuit on PCB Kulyk N, An CY, Oh JH, Cho SM, Ryu C, Ko YK, Chung CH Korean Journal of Chemical Engineering, 27(1), 310, 2010 |
5 |
Characterization of FePt film electrodeposited with a ferric electrolyte Cherevko S, Fu J, Song KY, Chung CH Korean Journal of Chemical Engineering, 26(6), 1766, 2009 |
6 |
The development of a fully integrated micro-channel fuel processor using low temperature co-fired ceramic (LTCC) Park JJ, Shin Y, Oh JH, Chung CH, Huh YJ, Haama S Journal of Industrial and Engineering Chemistry, 15(5), 618, 2009 |
7 |
Single-layer organic-light-emitting devices fabricated by screen printing method Lee DH, Choi J, Chae H, Chung CH, Cho SM Korean Journal of Chemical Engineering, 25(1), 176, 2008 |
8 |
Removal of Paraquat in Aqueous Suspension of TiO2 in an Immersed UV Photoreactor Lee JC, Kim MS, Kim CK, Chung CH, Cho SM, Han GY, Yoon KJ, Kim BW Korean Journal of Chemical Engineering, 20(5), 862, 2003 |
9 |
Slugging Bed Height of Polyethylene Particles in a Fluidized Bed with an Expanded Section Cho H, Chung C, Han G Korean Journal of Chemical Engineering, 18(4), 567, 2001 |
10 |
Axial Gas Dispersion in a Fluidized Bed of Polyethylene Particles Cho HI, Chung CH, Han GY, Ahn GR, Kong JS Korean Journal of Chemical Engineering, 17(3), 292, 2000 |