화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Korean Journal of Chemical Engineering, Vol.27, No.1, 310-314, January, 2010
DOI10.1007/s11814-009-0289-1  Export Citation
Study on electrochemical mechanical polishing process of copper circuit on PCB
Nadiia Kulyk, Chang Yong An, Jung Hoon Oh, Sung Min Cho, Changsup Ryu1, Young Kwan Ko1, and Chan-Hwa Chung†
  • School of Chemical Engineering, Sungkyunkwan University, Suwon 440-746, Korea
  • 1Central R&D Institute, Samsung Electro-Mechanics Co., Ltd., Suwon 443-743, Korea
E-mail:
As an alternative to conventional chemical mechanical polishing (CMP) for the planarization of copper layers on electronic circuits, the electrochemical mechanical polishing (ECMP) process in alkali-based solution was investigated in this work. The influence of the polishing pad materials on the polishing process was studied, and the hard polyurethane polishing pad was shown to eliminate the “dishing effect”. The polishing conditions, such as the pad rotating speed, concentration of H2O2, and the amount of BTA additives were optimized to control the planarization performance. As a result, good planarization uniformity was obtained not only in small scale (30 μm) trenches but also in very large scale (a few mm) patterns with a single step ECMP process.
Keywords:Electrochemical Mechanical Polishing;Copper;PCB;Planarization
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