검색결과 : 10건
| No. | Article |
|---|---|
| 1 |
New insights on SOI Tunnel FETs with low-temperature process flow for CoolCube (TM) integration Llorente CD, Le Royer C, Batude P, Fenouillet-Beranger C, Martinie S, Lu CMV, Allain F, Colinge JP, Cristoloveanu S, Ghibaudo G, Vinet M Solid-State Electronics, 144, 78, 2018 |
| 2 |
Plasma combined self-assembled monolayer pretreatment on electroplated-Cu surface for low temperature Cu-Sn bonding in 3D integration Wang JQ, Wang Q, Wu ZJ, Tan L, Cai J, Wang DJ Applied Surface Science, 403, 525, 2017 |
| 3 |
Influence of Si wafer thinning processes on (sub)surface defects Inoue F, Jourdain A, Peng L, Phommahaxay A, De Vos J, Rebibis KJ, Miller A, Sleeckx E, Beyne E, Uedono A Applied Surface Science, 404, 82, 2017 |
| 4 |
Combined surface activated bonding using H-containing HCOOH vapor treatment for Cu/Adhesive hybrid bonding at below 200 degrees C He R, Fujino M, Akaike M, Sakai T, Sakuyama S, Suga T Applied Surface Science, 414, 163, 2017 |
| 5 |
A monolithic 3D integrated nanomagnetic co-processing unit Becherer M, Gamma SBV, Eichwald I, Ziemys G, Kiermaier J, Csaba G, Schmitt-Landsiedel D Solid-State Electronics, 115, 74, 2016 |
| 6 |
UTBB FDSOI: Evolution and opportunities Monfray S, Skotnicki T Solid-State Electronics, 125, 63, 2016 |
| 7 |
Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics Park M, Baek S, Kim S, Kim SE Applied Surface Science, 324, 168, 2015 |
| 8 |
Low-temperature solid state bonding method based on surface Cu-Ni alloying microcones Lu Q, Chen Z, Zhang WJ, Hu AM, Li M Applied Surface Science, 268, 368, 2013 |
| 9 |
On the electrochemistry of an anode stack for all-solid-state 3D-integrated batteries Baggetto L, Oudenhoven JFM, van Dongen T, Klootwijk JH, Mulder M, Niessen RAH, de Croon MHJM, Notten PHL Journal of Power Sources, 189(1), 402, 2009 |
| 10 |
Fabrication of n-type Schottky barrier thin-film transistor with channel length and width of 0.1 mu m and erbium silicide source/drain Yang JH, Ahn CG, Baek IB, Jang MG, Sung GY, Park BC, Im K, Lee S Thin Solid Films, 517(5), 1825, 2009 |