| 1 |
Texturing of silicon using a microporous polymer etch mask
Korivi NS, Hoffpauir J, Ajmera PK
Journal of Vacuum Science & Technology B, 28(6), C6K8, 2010 |
| 2 |
Surface modification of silicon-containing fluorocarbon films prepared by plasma-enhanced chemical vapor deposition
Jin YY, Desta Y, Goettert J, Lee GS, Ajmera PK
Journal of Vacuum Science & Technology A, 23(4), 666, 2005 |
| 3 |
Process characterization of plasma enhanced chemical vapor deposition of silicon nitride films with disilane as silicon source
Nallapati G, Ajmera PK
Journal of Vacuum Science & Technology B, 16(3), 1077, 1998 |
| 4 |
Low-Temperature Plasma-Enhanced Chemical-Vapor-Deposition of Fluorinated Silicon-Oxide Films as an Interlayer Dielectric
Song JH, Ajmera PK, Lee GS
Journal of Vacuum Science & Technology B, 15(5), 1843, 1997 |
| 5 |
Effects of Native-Oxide Removal from Silicon Substrate and Annealing on SiO2-Films Deposited at 120-Degrees-C by Plasma-Enhanced Chemical-Vapor-Deposition Using Disilane and Nitrous-Oxide
Song JH, Ajmera PK, Lee GS
Journal of Vacuum Science & Technology B, 14(2), 727, 1996 |
| 6 |
Chemical and Electrical Characteristics of Low-Temperature Plasma-Enhanced CVD Silicon-Oxide Films Using Si2H6 and N2O
Song JH, Lee GS, Ajmera PK
Thin Solid Films, 270(1-2), 512, 1995 |
