| 1 |
Study of high thermal conductive epoxy resins containing controlled high-order structures
Akatsuka M, Takezawa Y
Journal of Applied Polymer Science, 89(9), 2464, 2003 |
| 2 |
Computer simulation for morphology, size, and density of oxide precipitates in CZ silicon
Sueoka K, Akatsuka M, Okui M, Katahama H
Journal of the Electrochemical Society, 150(8), G469, 2003 |
| 3 |
Calculation of size distribution of void defects in CZ silicon
Akatsuka M, Okui M, Umeno S, Sueoka K
Journal of the Electrochemical Society, 150(9), G587, 2003 |
| 4 |
Delamination mechanism of high-voltage coil insulators made from mice flakes and thermosetting epoxy resin
Akatsuka M, Takezawa Y, Kamiya H
Journal of Applied Polymer Science, 79(12), 2164, 2001 |
| 5 |
Influences of inorganic fillers on curing reactions of epoxy resins initiated with a boron trifluoride amine complex
Akatsuka M, Takezawa Y, Amagi S
Polymer, 42(7), 3003, 2001 |
| 6 |
Thermal and mechanical properties of liquid crystalline epoxy resins as a function of mesogen concentration
Farren C, Akatsuka M, Takezawa Y, Itoh Y
Polymer, 42(4), 1507, 2001 |
| 7 |
Classification of etch pits at silicon wafer surface using image-processing instrument
Akatsuka M, Sueoka K, Yamamoto T
Journal of Crystal Growth, 210(1-3), 366, 2000 |
| 8 |
Effect of heavy boron doping on oxygen precipitation in Czochralski silicon substrates of epitaxial wafers
Sueoka K, Akatsuka M, Yonemura M, Ono T, Asayama E, Katahama H
Journal of the Electrochemical Society, 147(2), 756, 2000 |
| 9 |
Investigation of the mechanical strength of hydrogen-annealed Czochralski silicon wafers
Sueoka K, Akatsuka M, Katahama H, Adachi N
Journal of the Electrochemical Society, 146(1), 364, 1999 |
| 10 |
Calculation of slip length in 300 mm silicon wafers during thermal processes
Akatsuka M, Sueoka K, Katahama H, Adachi N
Journal of the Electrochemical Society, 146(7), 2683, 1999 |
