검색결과 : 26건
| No. | Article |
|---|---|
| 1 |
Model-assisted development of microfabricated 3D Ni(OH)(2) electrodes with rapid charging capabilities Huang CP, Armutlulu A, Allen MG, Allen SAB Journal of Power Sources, 358, 101, 2017 |
| 2 |
Electroless Deposition of Copper on Organic and Inorganic Substrates Using a Sn/Ag Catalyst Fritz N, Koo HC, Wilson Z, Uzunlar E, Wen ZS, Yeow X, Allen SAB, Kohl PA Journal of the Electrochemical Society, 159(6), D386, 2012 |
| 3 |
All-copper chip-to-substrate interconnects - Part II. Modeling and design He A, Osborn T, Allen SAB, Kohl PA Journal of the Electrochemical Society, 155(4), D314, 2008 |
| 4 |
Low-temperature bonding of copper pillars for all-copper chip-to-substrate interconnections He A, Osborn T, Allen SAB, Kohl PA Electrochemical and Solid State Letters, 9(12), C192, 2006 |
| 5 |
Plasma treatment and surface analysis of polyimide films for electroless copper buildup process Bhusari D, Hayden H, Tanikella R, Allen SAB, Kohl PA Journal of the Electrochemical Society, 152(10), F162, 2005 |
| 6 |
Fabrication of multifunctional optical I/O via imprint lithography He A, Allen SAB, Kohl PA Electrochemical and Solid State Letters, 7(10), F55, 2004 |
| 7 |
Crosslinking and decomposition reactions of epoxide-functionalized polynorbornene. II. Impact of reactions on mechanical properties Chiniwalla P, Bai YQ, Elce E, Shick R, Allen SAB, Kohl P Journal of Applied Polymer Science, 91(2), 1020, 2004 |
| 8 |
Photosensitive polynorbornene based dielectric. I. Structure-property relationships Bai YQ, Chiniwalla P, Elce E, Shick RA, Sperk J, Allen SAB, Kohl PA Journal of Applied Polymer Science, 91(5), 3023, 2004 |
| 9 |
Photosensitive polynorbornene based dielectric. II. Sensitivity and spatial resolution Bai YQ, Chiniwalla P, Elce E, Allen SAB, Kohl PA Journal of Applied Polymer Science, 91(5), 3031, 2004 |
| 10 |
Hydrophobic/hydrophilic surface modification within buried air channels Salas-Vernis JL, Jayachandran JP, Park S, Kelleher HA, Allen SAB, Kohl PA Journal of Vacuum Science & Technology B, 22(3), 953, 2004 |