1 |
Effect of beveled mesa angle on the leakage performance of 4H-SiC avalanche photodiodes Chong E, Koh YJ, Lee DH, Bae IH, Kim JS, Jeong YS, Ryu JY, Lee JY, Kang MJ, Park JH, Choi KK Solid-State Electronics, 156, 1, 2019 |
2 |
Effect of seed layers and rapid thermal annealing on the temperature coefficient of resistance of Ni-Cr thin films Kim YJ, Lee WB, Choi KK Thin Solid Films, 675, 96, 2019 |
3 |
Optimizing fin design for a PCM-based thermal storage device using dynamic Kriging Augspurger M, Choi KK, Udaykumar HS International Journal of Heat and Mass Transfer, 121, 290, 2018 |
4 |
Strategies for efficient machine learning of surrogate drag models from three-dimensional mesoscale computations of shocked particulate flows Das P, Sen O, Choi KK, Jacobs G, Udaykumar HS International Journal of Multiphase Flow, 108, 51, 2018 |
5 |
Wafer level package of Au-Ge system using a Ge chemical vapor deposition (CVD) thin film Choi KK, Hosseini N, Kee J, Kim SK, Park CG Applied Surface Science, 385, 122, 2016 |
6 |
Effect of castor oil/polycaprolactone hybrid polyols on the properties of biopolyurethane Choi KK, Park SH, Oh KW, Kim SH Macromolecular Research, 23(4), 333, 2015 |
7 |
Filling performance and electrical characteristics of Al2O3 films deposited by atomic layer deposition for through-silicon via applications Choi KK, Kee J, Kim SH, Park MS, Park CG, Kim DK Thin Solid Films, 556, 560, 2014 |
8 |
Rheological modeling and finite element simulation of epoxy adhesive creep in FRP-strengthened RC beams Choi KK, Taha MMR Journal of Adhesion Science and Technology, 27(5-6), 523, 2013 |
9 |
Improvement of the Light Output Power of GaN-Based Vertical Light Emitting Diodes by a Current Blocking Layer Jeong HH, Lee SY, Jeong YK, Choi KK, Song JO, Lee YH, Seong TY Electrochemical and Solid State Letters, 13(7), H237, 2010 |
10 |
Fabrication of High Performance GaN-Based Vertical Light-Emitting Diodes Using a Transparent Conducting Indium Tin Oxide Channel Layer Jeong HH, Lee SY, Song JO, Choi KK, Lee SH, Choi HS, Oh TH, Lee YH, Seong TY Electrochemical and Solid State Letters, 12(9), H322, 2009 |