검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Characterization of slurries used for chemical-mechanical polishing (CMP) in the semiconductor industry Kuntzsch T, Witnik U, Hollatz M, Stintz M, Ripperger S Chemical Engineering & Technology, 26(12), 1235, 2003 |
| 2 |
Characterization of suspensions from chemical-mechanical polishing in the semiconductor industry Kuntzsch T, Hollatz M, Stintz M, Ripperger S Chemie Ingenieur Technik, 74(8), 1151, 2002 |