화학공학소재연구정보센터
검색결과 : 7건
No. Article
1 Thermal stability of Al/barrier/TiSix multilayer structures
Lu JP, Hsu WY, Hong QZ, Dixit GA, Luttmer JD, Havemann RH, Chen PJ, Tsai HL, Magel LK
Thin Solid Films, 320(1), 20, 1998
2 Self-aligned Ti and Co silicides for high performance sub-0.18 mu m CMOS technologies
Kittl JA, Hong QZ
Thin Solid Films, 320(1), 110, 1998
3 Advanced salicides for 0.10 mu m CMOS : Co salicide processes with low diode leakage and Ti salicide processes with direct formation of low resistivity C54 TiSi2
Kittl JA, Hong QZ, Yang H, Yu N, Samavedam SB, Gribelyuk MA
Thin Solid Films, 332(1-2), 404, 1998
4 Effect of Ar Sputter Etch on the Texture of Ti and Al/Tin/Ti Metal Stack
Hsu WY, Hong QZ, Liu HY, Douglas M, Taylor K, Magel LK, Luttmer JD, Havemann RH
Journal of the Electrochemical Society, 144(9), L248, 1997
5 A Novel Process for Fabricating Conformal and Stable Tin-Based Barrier
Lu JP, Hsu WY, Hong QZ, Dixit GA, Luttmer JD, Havemann RH, Magel LK
Journal of the Electrochemical Society, 143(12), L279, 1996
6 Materials Aspects of Ti and Co Silicidation of Narrow Polysilicon Lines
Kittl JA, Hong QZ
Thin Solid Films, 290-291, 473, 1996
7 Thermal-Stability of Silicide on Polycrystalline Si
Hong QZ, Hong SQ, Dheurle FM, Harper JM
Thin Solid Films, 253(1-2), 479, 1994