검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching Filippi RG, Gribelyuk MA, Joseph T, Kane T, Sullivan TD, Clevenger LA, Costrini G, Gambino J, Iggulden RC, Kiewra EW, Ning XJ, Ravikumar R, Schnabel RF, Stojakovic G, Weber SJ, Gignac LM, Hu CK, Rath DL, Rodbell KP Thin Solid Films, 388(1-2), 303, 2001 |
| 2 |
Temperature dependence of the Al-fill processes for submicron-via structures Weber SJ, Iggulden RC, Schnabel RF, Weigand P, Restaino DD, Brodsky SB, Mehter EA, Clevenger LA Thin Solid Films, 320(1), 63, 1998 |