검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Reliability prediction for 95.5Sn3.9Ag0.6Cu solder bump and thermal design for lead free system in package with polymer-based material Hsu HC, Hung WM Materials Science Forum, 505-507, 289, 2006 |
| 2 |
[기획특집-고부가 정보소재 개발 현황] 환경친화성 EMC 기술동향 윤효창 Prospectives of Industrial Chemistry, 5(2), 35, 2002 |